TT Electronics announced the debut of its HPDC series high power density chip resistors. This specialist design is optimised for power management, actuator drive, and heating applications which benefit from the enhanced heat transfer from element to terminal. The use of such high power density components saves PCB area and boosts reliability by restricting the temperature rise in the component hotspot.
“Aluminium nitride – with its wide area solder terminations – gives TT’s HPDC series our highest power density to date. With this product, our customers can reduce the size of their power conversion designs, while enhancing the reliability of the assembly through restricting the component hotspot temperatures,” said Brian Stephenson, Director of Engineering, TT Electronics. “These features make the HPDC family ideal for applications with high momentary load conditions, such as power supplies, motor drives, power amplifiers, and actuator controls.”
TT Electronics plc (LON:TTG) is a provider of engineered electronics applications for performance-critical applications. The Company works with customers in the industrial, medical, aerospace and defence, and transportation sectors.
