Tony Pialis shares his journey and vision for Alphawave Semi

The AlphaCHIP-M 1.2 Tbps is a sophisticated memory chiplet designed to deliver high-speed and efficient memory expansion, supporting the latest DDR5 and UCIe protocols. With up to 9600 Gbps DDR5 I/O and the flexibility to adjust

Alphawave Semi, a leading player in high-speed connectivity and computing silicon, has secured a research grant from the UK’s Advanced Research and Invention Agency (ARIA). This funding aims to address networking bottlenecks that are currently stifling

Alphawave Semi has been selected for a research grant from the UK’s Advanced Research and Invention Agency (ARIA) to address networking challenges that are slowing down artificial intelligence (AI) development. The grant aims to reduce bottlenecks

We’re witnessing a time like no other, where the rapid adoption of technology is shaping nearly every sector, from tech itself to financial services and healthcare. The surge in interest in generative AI, the Internet of

As we move forward in the digital age, the groundwork for 6G wireless technology is taking shape even as 5G systems continue to expand. With the capability to unite communication and computing, 6G promises to create

As the world continues to see the deployment of 5G wireless communication systems, enterprises are already looking ahead to the next generation—6G. This upcoming advancement is expected to revolutionise the way we live by merging communication

Alphawave Semi, a global company specialising in high-speed connectivity and compute silicon for technology infrastructure, has introduced the industry’s first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem. This development was achieved through

Alphawave Semi, a global leader in high-speed connectivity and compute silicon, has recently been recognised with the TSMC 2024 OIP Partner of the Year Award for High-Speed SerDes IP. This marks the fifth consecutive year that

Alphawave Semi, a global leader in high-speed connectivity and compute silicon, has announced the availability of the industry’s first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP subsystem. Built using TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced

Alphawave Semi has been recognised as the TSMC 2024 OIP Partner of the Year for High-Speed SerDes IP, underscoring its commitment to advancing connectivity and compute silicon globally. This achievement marks the fifth year in a

Alphawave Semi, a leading player in high-speed connectivity and compute silicon for global technology infrastructure, has announced the continuation of its collaboration with InnoLight Technology. InnoLight, a recognised leader in data centre and AI networking optics,

At the AI Hardware Summit held in the Bay Area, Allyson Klein from TechArena had an insightful conversation with Letizia Giuliano from Alphawave Semi, discussing the latest advancements in AI connectivity, chiplet designs, and the move