Alphawave Semi receives TSMC Award for advancements in high-speed connectivity

Alphawave Semi has been recognised as the TSMC 2024 OIP Partner of the Year for High-Speed SerDes IP, underscoring its commitment to advancing connectivity and compute silicon globally. This achievement marks the fifth year in a row that Alphawave Semi has been honoured for its contributions to design enablement within TSMC’s Open Innovation Platform (OIP).

During the TSMC OIP Ecosystem Forum, Alphawave Semi was celebrated for its notable advancements in silicon connectivity. These include comprehensive IP solutions supporting speeds up to 224Gbps for Ethernet and PCIe, and the ZeusCORE100® 1-112Gbps NRZ/PAM4 SerDes on TSMC’s advanced N3E process. The forum brought together semiconductor partners and TSMC customers to discuss new technologies for various applications like HPC, mobile, automotive, and IoT.

Reflecting on the collaboration with TSMC, Tony Pialis, CEO and co-founder of Alphawave Semi, highlighted significant breakthroughs over the past year, including the deployment of their first test chip on TSMC’s N3P process. Pialis emphasised that this partnership is crucial for developing advanced connectivity solutions for servers, networking, and storage, aligning with the needs of hyperscalers and semiconductor customers.

Dan Kochpatcharin, from TSMC, noted that Alphawave Semi’s contributions play an important role in providing engineering teams with advanced solutions for developing complex designs on cutting-edge process nodes. He stated that the TSMC partner awards highlight contributions that push the efficiency and speed of next-generation high-performance designs.

Alphawave Semi’s VP of IP Product Marketing, Letizia Giuliano, alongside Arm’s Sridhar Valluru, presented on architecting next-generation terabit AI networks. They discussed the challenges involved in scaling AI and the importance of UCIe-enabled AI chiplets in addressing limitations within leading-edge SoCs. The company showcased the first-ever 3nm UCIe IP with TSMC CoWoS packaging and demonstrated their multi-protocol I/O connectivity chiplet, which was designed for AI infrastructure. Attendees witnessed a live demonstration of Alphawave Semi’s UCIe chiplet, showing 24 Gbps per lane die-to-die communication, setting a new benchmark in high-performance computing.

In addition, Alphawave Semi displayed its HBM3E subsystem tailored for AI workloads, along with its 128G PCIe 7.0 over optics IP, demonstrating a clear commitment to meeting the demands of AI and high-performance computing systems.

Alphawave IP Group plc (LON:AWE) is a semiconductor IP company focused on providing DSP based, multi-standard connectivity Silicon IP solutions targeting both data processing in the Datacenter and data generation by IoT end devices.

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