Alphawave Semi driving the future of high-speed connectivity in 2025

As the demand for seamless, high-speed connectivity surges, Alphawave Semi is shaping the innovations that will underpin the networks of tomorrow. Michael Klempa, a Product Marketing Engineer at Alphawave Semi, shares pivotal insights into how emerging technologies are transforming data transmission, challenging conventional methods, and enabling unprecedented speeds.

Artificial intelligence (AI) networks are increasingly demanding faster, more efficient communication, with 400G signalling speeds becoming a new benchmark. This leap forward will require the industry to accelerate the development of innovative networking solutions, meeting rigorous performance needs under tighter timelines. The shift to 400G will likely see traditional technologies, commonly used at speeds of 50G to 200G, replaced as engineers reimagine modulation schemes and form factors to optimise connectivity at this scale.

Coherent optical technologies are also poised for a significant evolution. Previously reserved for long-haul applications, these advanced methods will expand their footprint into shorter-reach scenarios while scaling to deliver a staggering 1.6 terabits per wavelength. This will address the explosive growth in bandwidth demand, ensuring robust performance across data-intensive sectors.

Alphawave IP Group plc (LON:AWE) is a semiconductor IP company focused on providing DSP based, multi-standard connectivity Silicon IP solutions targeting both data processing in the Datacenter and data generation by IoT end devices.

Click to view all articles for the EPIC:
Or click to view the full company profile:
Facebook
X
LinkedIn
Alphawave IP Group plc

More articles like this

Alphawave IP Group plc

AI and bandwidth shape electronics in 2025

The electronics industry in 2025 is set for transformation with AI integration and high bandwidth solutions. Synaptics and Alphawave Semi lead the way in innovation.

Alphawave IP Group plc

Innovative advances in implementing high bandwidth memory systems

The journey to implementing a 2.5D System-in-Package (SiP) with High Bandwidth Memory (HBM) is complex and multifaceted. It involves defining the architecture, designing a highly reliable interposer channel, and conducting robust testing of the data path,