Alphawave Semi is redefining the standards of high-speed connectivity and compute silicon with the launch of its 64 Gbps Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP Subsystem. This milestone introduces record-breaking chiplet interconnect data rates designed to transform connectivity in critical technology domains like AI, high-performance computing, and data centers.
With the introduction of its Gen3 64 Gbps UCIe IP Subsystem, Alphawave Semi builds on its proven Gen1 24 Gbps and Gen2 36 Gbps systems, offering unmatched bandwidth density of over 20 Tbps/mm on TSMC’s cutting-edge 3nm technology. This innovative subsystem achieves ultra-low power and latency while supporting multiple configurable protocols such as AXI-4, CXS, and CHI-C2C. The design is tailored for modern demands in disaggregated systems, setting the stage for scalable, open, and interoperable chiplet ecosystems.
The Gen3 solution aligns with the latest UCIe specifications and boasts a robust architecture featuring advanced testability tools like live per-lane health monitoring. This makes it a resilient foundation for seamless connectivity across compute and I/O chiplets, optical retimers, and memory dies in high-bandwidth, low-latency environments. Alphawave Semi’s unique approach includes integrating memory dies directly with compute dies to optimize performance for AI workloads, where efficiency and speed are critical differentiators.
Industry experts, such as the UCIe Consortium, have praised Alphawave Semi’s achievements as instrumental in driving broader adoption of open standards that accelerate innovation and reduce time-to-market. This success further positions Alphawave Semi as a leader in delivering scalable, high-performance chiplet solutions that enable breakthroughs in technology infrastructure.
As a global leader in connectivity, Alphawave Semi specializes in high-speed interconnect solutions that underpin modern data infrastructure and hyperscale computing.
Alphawave IP Group plc (LON:AWE) is a semiconductor IP company focused on providing DSP based, multi-standard connectivity Silicon IP solutions targeting both data processing in the Datacenter and data generation by IoT end devices.
