Alphawave Semi reports third consecutive quarter of bookings above $100m

At the AI Hardware Summit held in the Bay Area, Allyson Klein from TechArena had an insightful conversation with Letizia Giuliano from Alphawave Semi, discussing the latest advancements in AI connectivity, chiplet designs, and the move

As AI continues to evolve, the need for new computing models and advanced data transmission methods has never been more crucial. PCIe over Optical is emerging as a vital technology to support the increasing demands for

In today’s fast-paced world of high-performance computing (HPC) and artificial intelligence (AI), the need for more powerful, efficient, and scalable processing solutions is growing rapidly. Traditional single-piece chip designs are struggling to keep up with these

Alphawave IP Group plc (LON:AWE) is a semiconductor IP company focused on providing DSP based, multi-standard connectivity Silicon IP solutions targeting both data processing in the Datacenter and data generation by IoT end devices.

In the fast-changing world of high-performance computing (HPC) and artificial intelligence (AI), there is an ever-growing need for enhanced processing power, efficiency, and scalability. Traditional chip designs struggle to meet these demands, leading to the emergence

Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, has appointed Sameer Ladiwala as Senior Vice President of Finance and Chief Accounting Officer (CAO). With over 25 years of

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon, has successfully launched the industry’s first 3nm silicon bring-up of Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP, utilising TSMC’s advanced Chip-on-Wafer-on-Substrate (CoWoS®)

The development of 3D-ICs and heterogeneous chiplets requires significant changes in physical layout tools, impacting the placement of chiplets and signal routing to enhance system performance and reliability. Key challenges include efficient thermal dissipation, as stacking

Alphawave Semi reported robust Q2 2024 results, with bookings reaching $107.4 million, reflecting a 27% increase year-over-year. This growth is largely due to the rising demand for chiplet-based designs in AI and data centre applications. During

Alphawave IP recently published its trading and business update for the three months ending 30 June 2024. CEO Tony Phialis announced that for the third consecutive quarter, the company achieved over US$100 million in bookings. This

GammaCORE, developed by Alphawave Semi, is a Universal Chiplet Interconnect Express (UCle™) Die-to-Die Controller IP that implements the latest UCIe 1.1 specification and supports UCIe Streaming protocol applications. This innovation facilitates multi-die applications such as connecting

Alphawave Semi is planning to establish an office in South Korea to enhance its IP sales to local fabless chip companies. Currently, it maintains a small team in the country, with its headquarters providing direct support

Alphawave IP Group plc (LON:AWE) is a semiconductor IP company focused on providing DSP based, multi-standard connectivity Silicon IP solutions targeting both data processing in the Datacenter and data generation by IoT end devices.

Alphawave Semi, a UK-registered company, specialises in high-performance connectivity solutions for the semiconductor industry. The company designs advanced, high-speed connectivity solutions for customers in high-growth end markets, including data centres, AI, 5G wireless infrastructure, data networking,

Alphawave Semi has introduced a groundbreaking 9.2 Gbps HBM3E sub-system silicon platform, including PHY and Controller IP. This platform, building on the company’s established HBM3E IP, achieves an impressive chiplet-enabled memory bandwidth of 1.2 Terabytes per

The open chiplet ecosystem is gradually taking shape, driven by innovative design demonstrations. Alphawave Semi has announced the tape-out of what it claims to be the industry’s first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC’s 7-nm