Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon, has successfully launched the industry’s first 3nm silicon bring-up of Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP, utilising TSMC’s advanced Chip-on-Wafer-on-Substrate (CoWoS®) packaging technology.
Developed in collaboration with TSMC, this complete PHY and Controller subsystem targets applications in hyperscaling, high-performance computing (HPC), and artificial intelligence (AI). The subsystem leverages TSMC’s CoWoS 2.5D silicon-interposer-based packaging, offering an impressive 8 Tbps/mm bandwidth density. This integration reduces I/O complexity, power consumption, and latency, making it highly efficient.
Supporting multiple protocols such as streaming, PCIe®, CXL™, AXI-4, AXI-S, CXS, and CHI, the IP ensures interoperability within the chiplet ecosystem. Additionally, it integrates live per-lane health monitoring to enhance robustness and supports a data rate of 24 Gbps, which is crucial for high-bandwidth D2D connectivity.
Mohit Gupta, Alphawave Semi’s SVP and GM of Custom Silicon and IP, highlighted this achievement, stating that the successful 3nm 24 Gbps UCIe subsystem with TSMC’s advanced packaging marks a significant milestone. It showcases Alphawave Semi’s expertise in leveraging TSMC’s 3DFabric™ ecosystem to deliver premier connectivity solutions. Gupta emphasised that this IP sets a new benchmark in high-performance connectivity solutions.
Alphawave Semi’s UCIe subsystem IP adheres to the latest UCIe Specification Rev 1.1 and features comprehensive testability and debug capabilities, including JTAG, BIST, DFT, and Known Good Die (KGD) functionalities.
Alphawave Semi’s innovative subsystem IP is poised to significantly impact hyperscaler, HPC, and AI applications, providing high-performance connectivity solutions with advanced packaging technology.
Alphawave IP Group plc (LON:AWE) is a semiconductor IP company focused on providing DSP based, multi-standard connectivity Silicon IP solutions targeting both data processing in the Datacenter and data generation by IoT end devices.
