Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon, has successfully launched the industry’s first 3nm silicon bring-up of Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D)

The development of 3D-ICs and heterogeneous chiplets requires significant changes in physical layout tools, impacting the placement of chiplets and signal routing to enhance system performance and reliability. Key challenges

Alphawave Semi reported robust Q2 2024 results, with bookings reaching $107.4 million, reflecting a 27% increase year-over-year. This growth is largely due to the rising demand for chiplet-based designs in

Alphawave IP recently published its trading and business update for the three months ending 30 June 2024. CEO Tony Phialis announced that for the third consecutive quarter, the company achieved

GammaCORE, developed by Alphawave Semi, is a Universal Chiplet Interconnect Express (UCle™) Die-to-Die Controller IP that implements the latest UCIe 1.1 specification and supports UCIe Streaming protocol applications. This innovation

Alphawave Semi is planning to establish an office in South Korea to enhance its IP sales to local fabless chip companies. Currently, it maintains a small team in the country,

Alphawave IP Group plc (LON:AWE) is a semiconductor IP company focused on providing DSP based, multi-standard connectivity Silicon IP solutions targeting both data processing in the Datacenter and data generation by

Alphawave Semi, a UK-registered company, specialises in high-performance connectivity solutions for the semiconductor industry. The company designs advanced, high-speed connectivity solutions for customers in high-growth end markets, including data centres,

Alphawave Semi has introduced a groundbreaking 9.2 Gbps HBM3E sub-system silicon platform, including PHY and Controller IP. This platform, building on the company’s established HBM3E IP, achieves an impressive chiplet-enabled